The retention properties of both types of devices remain

The retention properties of both types of devices remain stable even after 104 s at 85°C, which satisfy the NVM requirements. The endurance performance is shown in Figure  4. During 104 pulse cycles, the HRS and LRS of Zr:SiO x RRAM are short (Figure  4a). While in Zr:SiO x /C:SiO

x RRAM device, it exhibits stable HRS and LRS even after more than 106 pulse cycles (Figure  4b). Figure 4 Endurance characteristics of (a) Pt/Zr:SiO 2 /TiN structure and (b) Pt/Zr:SiO 2 /C:SiO 2 /TiN structure. Conclusion In conclusion, by co-sputtering C and Zr with SiO2, respectively, we fabricated a double resistive switching layer RRAM, which has significantly outstanding performance. Both FTIR and Raman spectra confirm the existence of graphene oxide in the switching layer of double active layer RRAM devices. Compared CP-690550 with the stochastic formation of conducting filaments, the adsorption and desorption of oxygen atoms from carbocycle work much more stable. This is also the reason why Zr:SiO x /C:SiO x structure has superior switching performance and higher stability. Acknowledgements This work was performed at the National Science Council Core Facilities Laboratory for Nano-Science and Nano-Technology in the Kaohsiung-Pingtung area and was supported by the National Science Council

of the Republic of China under contract nos. NSC-102-2120-M-110-001, and NSC 101-2221-E-110-044-MY3. References 1. Nomura K, Ohta H, Takagi A, Kamiya T, Hirano this website M, ATR inhibitor Hosono H: Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors. Nature

2004, 432:488.CrossRef 2. Tsai CT, Chang TC, Chen SC, Lo I, Tsao SW, Hung MC, Chang JJ, Wu CY, Huang CY: Influence of positive bias stress on N 2 O plasma improved InGaZnO thin film transistor. Appl Phys Lett 2010, 96:242105.CrossRef 3. Chen TC, Chang TC, Tsai CT, Hsieh TY, Chen SC, Lin CS, Hung MC, Tu CH, Chang JJ, Chen PL: Behaviors of InGaZnO thin film transistor under illuminated positive gate-bias stress. Appl Phys Lett 2010, 97:112104.CrossRef 4. Yabuta H, Sano M, Abe K, Aiba T, Den T, Kumomi H: High-mobility thin-film transistor with amorphous Pregnenolone InGaZnO 4 channel fabricated by room temperature rf-magnetron sputtering. Appl Phys Lett 2006, 89:112123.CrossRef 5. Chen TC, Chang TC, Hsieh TY, Lu WS, Jian FY, Tsai CT, Huang SY, Lin CS: Investigating the degradation behavior caused by charge trapping effect under DC and AC gate-bias stress for InGaZnO thin film transistor. Appl Phys Lett 2011, 99:022104.CrossRef 6. Chung WF, Chang TC, Li HW, Chen SC, Chen YC, Tseng TY, Tai YH: Environment-dependent thermal instability of sol–gel derived amorphous indium-gallium-zinc-oxide thin film transistors. Appl Phys Lett 2011, 98:152109.CrossRef 7. Jeong S, Ha YG, Moon J, Facchetti A, Marks TJ: Role of gallium doping in dramatically lowering amorphous-oxide processing temperatures for solution-derived indium zinc oxide thin-film transistors.

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